StarTech.com SILVGREASE10-PRO heat sink compound Thermal paste 14.5 W/m·K 0.353 oz (10 g)

Manufacturer part number SILVGREASE10-PRO
Vendor StarTech.com


Short Description
StarTech.com SILVGREASE10-PRO, Thermal paste, 14.5 W/m·K, Aluminum oxide, Silicone, Zinc oxide, Gray, 1.42 °C/W, 2.65 g/cm³
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StarTech.com SILVGREASE10-PRO heat sink compound Thermal paste 14.5 W/m·K 0.353 oz (10 g)
StarTech.com SILVGREASE10-PRO heat sink compound Thermal paste 14.5 W/m·K 0.353 oz (10 g)
StarTech.com SILVGREASE10-PRO heat sink compound Thermal paste 14.5 W/m·K 0.353 oz (10 g)
StarTech.com SILVGREASE10-PRO heat sink compound Thermal paste 14.5 W/m·K 0.353 oz (10 g)
StarTech.com SILVGREASE10-PRO heat sink compound Thermal paste 14.5 W/m·K 0.353 oz (10 g)

Description

Performance Thermal Paste - 10g

Improve cooling performance in workstations, servers, and compact systems with this high-performance thermal paste, designed for efficient heat transfer and safe application in professional environments.

Reliable Thermal Transfer for Demanding Systems

Silicone-based thermal compound features a thermal conductivity of 14.5 W/m • K and an operating range of -58°F to +536°F (-50°C to +280°C); helping maintain thermal stability in CPUs, GPUs, and ICs with high TDP under continuous load.

Safe for Sensitive Components

Electrically non-conductive grease helps prevent shorts, supporting safe use in spaced constrained or critical system builds.

Precise and Reusable Application

Includes a resealable 10g syringe with screw cap and plunger for controlled, repeatable use in upgrades, repairs, or custom builds.

  • Improve Heat Transfer with High-Performance Thermal Paste: Professional-grade silicone-based compound delivers efficient heat transfer for processors, GPUs, and ICs; Maintain stable temperatures in computers, servers, and mission critical systems
  • Manage High Temps in Space-Constrained Builds: High-performance thermal grease with 14.5W/m-K conductivity and -58 to +536F (-50 to +280C) range; Improve heat control on CPUs, GPUs, and ICs in compact PCs and embedded systems under sustained workloads
  • Protect Components with Non-Conductive Thermal Compound: Electrically insulating compound helps prevent shorts if paste contacts nearby components, ensuring safe application and reliable operation while reducing downtime and maintenance
  • Simplified Application: 10g syringe with screw cap design prevents spills and allows easy reuse, while the plunger enables clean and controlled application; Use on your workstation for custom builds, upgrades, and component maintenance
  • The IT Pro's Choice: Our thermal product solutions are engineered to deliver consistent performance in professional environments and are tested for lasting reliability on critical components; Backed by free lifetime 24/5 multilingual technical assistance

  • Thermal paste 14.5 W/m·K
  • 1.42 °C/W 2.65 g/cm³
  • Constitutive ingredients: Aluminum oxide, Silicone, Zinc oxide
  • Gray
  • 1 pc(s)

Specifications

Features
Type Thermal paste
Thermal conductivity 14.5 W/m·K
Constitutive ingredients Aluminum oxide, Silicone, Zinc oxide
Operating temperature (T-T) -50 - 280 °C
Specific gravity 2.65 g/cm³
Thermal resistance 1.42 °C/W
Product color Gray
Logistics data
Master (outer) case height 10" (255 mm)
Master (outer) case width 19.7" (500 mm)
Master (outer) case length 13" (330 mm)
Quantity per master (outer) case 120 pc(s)
Packaging data
Quantity per pack 1 pc(s)
Scraper Yes
Package depth 2.36" (60 mm)
Package height 1.18" (30 mm)
Package width 6.3" (160 mm)
Package weight 1.55 oz (44 g)
Technical details
Compliance certificates RoHS
Weight & dimensions
Weight 0.353 oz (10 g)
Width 1.05" (26.6 mm)
Depth 4.96" (126 mm)
Height 0.677" (17.2 mm)

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